Product Description

http://www.chinarfid.biz/sell-3878455-rfid-flip-chip-bonding-machine-rfm500.html

Specifications:

Dimension: 620mm*650mm*680mm

Weight:75KG

Power:300W

Barometric Pressure: 5 bar≤P≤7 bar

Mechanical Controlling:Anisotropic electro-conductively paste,Manual material loading,Manual Focusing, Manual chip attaching,and transfer to hot-pressing.

Pressure Range;50-200g±1g

Work piece:Antenna≤100mm*80mm

Chipset 0.3mm*0.3mm-2mm*2mm

Video: One visual orientation system

Bonding Accuracy:±25um

Substrate Material:PET PVC  PAPER

Glue Type:ACA NCA ICA 

Payment Terms︰ TT/L/C