flip-chip bonding machinery

flip-chip bonding machinery

Model No.︰RFM1180

Brand Name︰cn

Country of Origin︰China

Unit Price︰US $ 35000 / set

Minimum Order︰1 set

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Product Description

Machine Structure:
1. Adhesive dispensing: it’s the same with RF1130, with fine adjustment in Z direction. Positioned by a CCD(CAM 1).
2.  Chip picking and pasting: Picking operation is the same as RF-1130, with fine adjustment in X, Y, Z three directions, can be revote in 360 degree in Z direction and with buffer device. Another CCD here is for the chip positioning.
3. Thermode: Both head of top and base thermode can be heated. Power source and controlling system is same as RF-1130. The position can be adjusted within 100mm to suit for different width of antenna.
4. Antenna feeding: Automatically feeding by stepping motor, positioned by sensor and precise positioned by CCD(CAM 1).
5. Antenna fixing device: There are vacuum holes on the fixing plate, through CCD( CAM1) to position.
Scheme Draft

Payment Terms︰ TT/L/C