http://www.chinarfid.biz/sell-3878455-rfid-flip-chip-bonding-machine-rfm500.html
Specifications:
Dimension: 620mm*650mm*680mm
Weight:75KG
Power:300W
Barometric Pressure: 5 bar≤P≤7 bar
Mechanical Controlling:Anisotropic electro-conductively paste,Manual material loading,Manual Focusing, Manual chip attaching,and transfer to hot-pressing.
Pressure Range;50-200g±1g
Work piece:Antenna≤100mm*80mm
Chipset 0.3mm*0.3mm-2mm*2mm
Video: One visual orientation system
Bonding Accuracy:±25um
Substrate Material:PET PVC PAPER
Glue Type:ACA NCA ICA
